Controlled state: 

External visual inspection work instructions

prepared by :

Review :

approve :

Effective Date: November 2 , 2022 Distribution Number:

Incoming product inspection standards

Purpose

Standardize the supplier's incoming material inspection process and standardize and program the standards for supplier incoming material inspection .

scope

Applicable to the quality control of incoming materials at the testing center of Lianchuangjie Technology Co., Ltd.;

Responsibilities

Receiving team: Responsible for supplier delivery signature, receiving inventory, receiving operations, reporting abnormal receipts, sending goods for inspection, and handling warehousing handover;

Testing Center: Responsible for the inspection of goods sent for inspection by the receiving group and feedback on abnormal detection; responsible for detecting and analyzing abnormal incoming materials , returns, and testing requirements submitted by other units, submitting test reports, and contacting external testing centers for in-depth analysis of abnormal goods;

Purchasing Department: Responsible for connecting with suppliers to track and handle abnormal goods detected by the testing center;

Warehousing team : Responsible for receiving, warehousing and putting on shelves the goods that have passed inspection or are exempt from inspection. .

Specific content

Incoming materials are temporarily accepted:

After the goods arrive, the receiving personnel will check the receiving information (quantity, model, packaging ) according to the supplier's delivery note . If there is no problem with the incoming materials, they will be packaged in accordance with the requirements of the "Electronic Component Packaging Operation Specifications" . The system inputs the model number and prints a barcode label on the corresponding product packaging and hands it to the inspection center personnel for general inspection of the incoming materials according to the order of arrival:

Incoming material inspection:

After receiving the information of the materials to be inspected, the testing center personnel select the inspection method based on the supplier's inspection level viewed in the system . The materials that need to be inspected are carried out in accordance with the GB/T2828.1-2012 normal single sampling plan (equivalent to MIL-STD-105E) Appearance inspection.

Inspection content:

Appearance inspection (illumination 500-800LUX inspection distance: 30cm inspection vision: naked

Inspection equipment for eyes or corrected visual acuity of 1.0 or above: visual inspection, magnifying glass, microscope Inspection time: 8-10S (i.e. the line of sight stays at a certain part)

Dimensional inspection (inspection equipment: caliper, micrometer. Thickness gauge )

X-ray inspection ( inspection equipment: X-ray non-destructive inspection tester )

Performance testing (inspection equipment: semiconductor tester, LCR bridge, multimeter, transistor grapher ) ( if necessary)

Solderability test (if necessary ) ( inspection equipment: lead-free solder furnace, soldering iron, hot air gun )

De-cap test (if necessary ) ( inspection equipment: laser capping machine )

Reference inspection basis ( including but not limited to IPC/JEDEC Solid State Technology Association standards, GB/T2828.1-2012 national standard sampling inspection standards, IDEA-STD-1010-B Independent Distributor Alliance electronic component quality inspection standards, customer requirements, specifications book, Golden Sample )

Labeling and handling of defective products

Marking: After the inspection is completed, if it is judged to be qualified, the IQC PASS stamp will be stamped on the bar code and placed in the inspected area. If it is judged to be unqualified or the materials to be processed need to be affixed with an unqualified label on the outer packaging and put into the unqualified area for isolation, and be quarantined in the system Record relevant exception information.

Handling of unqualified products: If any appearance defects or doubtful points are found during the inspection and a clear judgment result cannot be accurately given, the purchaser needs to contact the supplier to assist in providing instructions and processing. If necessary, a third party can be arranged to conduct De-cap or other tests; If NG is detected , the procurement must be notified to contact the supplier for return processing, and the unqualified products must be marked and placed in the unqualified product area.

Special materials: If special materials (such as materials customized by major customers) and non-conventional materials are encountered during the IQC inspection process , they will be treated as unqualified products and returned to the supplier. The relevant sales will be notified, such as due to delivery deadlines, urgent needs, etc. In the case of concession acceptance, the business end shall initiate a special procurement application.

Special procurement can only be made if the department manager approves it and the supplier provides instructions and a quality assurance letter;

If the supplier cannot provide the above information, it will be rejected;

Unit definition

Final packaging: All final items must be 100% inspected;

Coiled materials: Regardless of whether the roll is full or broken, the material tray needs to be disassembled for visual inspection. The sampling quantity is based on the material tray.

Pipe packaging materials: Sampling inspection shall be carried out on a pipe-by-pipe basis.

Bulk materials: Sampling inspection based on total quantity.

Tray-packed materials: Sampling inspection will be carried out in units of trays.

Test definition

Defect level: Defects found during sampling inspection that do not meet quality standards, and are divided into the following three types:

Fatal defects ( CR ) : Defects that can or may endanger the life or property safety of the user or carrier are called fatal and serious defects, represented by CR .

Major defects ( MAJ ) : Defects that cannot be used normally or have poor performance are called major defects and are represented by MAJ .

Minor defects ( MIN ) : Defects that do not affect the normal use of the product are called minor defects and are represented by MIN .

Definition of AQL

AQL is the upper limit of acceptable quality department yield, also known as the allowable quality level.

Acceptance standards: Our company’s acceptance standards for defective defects during incoming material inspection. The acceptance level of incoming materials should be stricter than or equal to the customer's acceptance level of products. If the customer's requirements for finished products are higher than the above standards, the customer's standards should be used as the basis.

CR defect, AQL=0

MAJ defect, AQL=0.4 MIN defect, AQL=0.65

Description of common abnormal appearance defects:

Oxidation problem

Minor defects ( MIN ) : Mild oxidation; invisible to the naked eye. Under the microscope, individual pins ( tin beads ) are oxidized , with a slight degree of oxidation and a dot-like distribution.

Main defect ( MAJ ) : Moderate oxidation; invisible to the naked eye, 1/3 of the lead angle (tin beads) is oxidized under the microscope , the degree of oxidation is slight, and it is distributed in a planar shape.

Fatal flaw ( CR ) : Severe oxidation: Visible to the naked eye, most of the pins (tin beads) are oxidized, with a deep oxidation degree and a planar distribution.

Pin deformation

Minor defects ( MIN ) : slight deformation; no more than two pins are bent and deformed ( the total number of pins is less than

10 , no more than one pin will be bent or deformed ) , and the bending angle shall not exceed 10 degrees.

Major Defect ( MAJ ) : Moderate deformation ; two to five pins bent and deformed ( total pin count less than 8

No more than two pins will be bent or deformed ) , and the bending angle is between 10 degrees and 25 degrees.

Fatal flaw ( C R ) : Severe deformation: More than five pins are bent and deformed ( the total number of pins is less than 8

If one is greater than two pins , the bending deformation is greater than 25 degrees.

Tin ball flat bead

Minor defects ( MIN ) : Slightly flattened beads ; the flattened area of ​​a single dome accounts for less than 1/10 of the tin bead area , and there is no obvious outline.

Major defect ( MAJ ) : Moderately flattened bead; the flattened area of ​​a single dome accounts for less than 1/10 of the tin bead area

By 1/4 , you can see obvious flattened contours or edges.

Fatal flaw ( CR ) : Severely flattened bead: the flattened area of ​​a single dome accounts for more than 1/4 of the tin bead area ,

The appearance of the tin beads is severely deformed.

Surface scratches (front )

Minor defects ( MIN ) : Mild scratches; there are few scratches on the surface of the body, the number does not exceed 2 , the length does not exceed 1/10 of the chip , and does not affect the surface silk screen, model, production date and other information.

Main defects ( M AJ ) : Moderate scratches; there are many scratches on the surface of the body, the number is within 2-5 , the length does not exceed 1/4 of the chip, visible to the naked eye, and does not affect the surface silk screen, model, production date, etc. information .

Fatal flaw ( C R ) : Severe scratches: There are many scratches on the surface of the body, the number is more than 5 , the length exceeds 1/2 of the chip, visible to the naked eye, the surface silk screen, model number, production date and other information are affected.

Substrate scratches (back )

Minor defects ( MIN ) : slight scratches; the scratch length does not exceed 1/5 of the lead length , the number does not exceed 2 , and the base material is not scratched. ( The scratch length of the BGA package substrate shall not exceed 1.5 bead spacing)

Major defects ( MAJ ) : Moderate scratches; the scratch length is between 1/5 and 3/5 of the lead length , the number of scratches is within 2-5 , and the base material is scratched. ( The scratch length of the BGA package substrate is between 1.5-3 beads)

Fatal defect ( C R ) : Severe scratches: the scratch length exceeds 3/5 of the pin length , and the number of scratches is greater than 5

Strips, the base material is scratched. ( The scratch length of the BGA package substrate is greater than the distance between 3 beads ) .

The main body is damaged

Minor defects ( MIN ) : slight damage; the overall shape has not changed, the packaging material is slightly damaged , and the internal circuitry of the body is not exposed.

Major defects ( MAJ ) : Moderate damage; slight change in overall shape, packaging material part

Damaged, the internal wiring of the body is not exposed.

Fatal flaw ( CR ) : Severe damage: The overall shape has changed significantly, the packaging material is damaged, and the internal circuitry of the body is exposed.

Board Strike ( BGA )

Minor defects ( MIN ) : slight bumps; slight bump defects on the surface of the substrate, invisible to the naked eye . No more than one collision.

Major defects ( MAJ ) : Moderate bumps; obvious bump defects on the surface of the substrate, visible to the naked eye . The bumps are between two and four.

Fatal flaw ( CR ) : Severe bumps: The substrate has many bumps or a large area, is seriously damaged, and the internal circuits are visible.

Sampling criteria:

Sampling rules: Sampling according to GB/T2828.1-2012 general inspection level II ; except for the following special packaging;

Palletized materials: full inspection of bulk items that are not whole packages; full inspection of unpacked pallets;

Rolled materials: Since sampling will damage the original tape packaging, during the sampling inspection process of rolled materials, it is necessary to extract the front , middle and rear sections of the tape to check the consistency of the internal material (use a microscope to see through the tape) Visual inspection ) , and then randomly select 2 PCS from the inside of the tape for physical inspection;

Multiple batches of materials from the same original tray: each batch needs to be randomly inspected, and the rules are the same as above;

For materials in multiple packages from the same batch, each package must be sampled;

X-RAY link sampling quantity: When the customer has requirements, the customer's requirements shall prevail. When the customer has no requirements, 2 PCS will be randomly selected for X-RAY testing; ( generally consistent with appearance sampling ) ;

Solderability and cover opening test randomly select 1 PCS for testing;

Inspection process:

Receipt :

The receiving team checks the basic information, model, brand, batch, and quantity based on the delivery list provided by the supplier. After confirmation, the system receives the goods for inspection;

Check the nature of the supplier :

When the supplier is an original manufacturer / authorized agent, the goods will be taken as a Golden Sample and taken as a reference for inspection. Sampling rules: Sampling is based on model, batch, brand, and origin dimensions, and sampling includes the original label. Pictures, silk screen pictures, X-ray pictures, wafer pictures (if necessary ) , upload the pictures to the gold sample database;

When the supplier is a trader / distributor, it will enter the normal quality inspection process;

Check label / packaging :

First, check whether the goods are in the original packaging and with the original labels. If there are original packaging and original labels, take a photo of the goods and check the authenticity of the labels and whether the label information is consistent with the original factory;

Whether the label is clear and complete;

Whether the label brand LOGO matches the original manufacturer;

Whether the label font and format are consistent with Golden Sample ;

The scanner gun scans the barcode and QR code to check whether the scanned information is consistent with the label description; e). Check that there are no abnormalities on the label, take a photo and upload it to the system inspection form; if there are any abnormalities that cannot be confirmed, you need to report back to the procurement and contact the supplier for cooperation. Provide instructions, and if necessary, apply for third-party testing to further confirm the authenticity of the material;

Is there any trace of opening on the seal of the original package? Is the packaging damaged or leaking? If there is any trace of opening,

If the original package is vacuum packed, C/D/NEW grade suppliers need to disassemble it and check the internal contents.

Open a package to see the actual product. A/B grade suppliers need to ask whether the purchase needs to be unpacked for inspection; for non-vacuum packaging, the actual product must be unpacked and photographed to keep the record;

Check the packaging (if the incoming goods are not in the original package, start checking the packaging directly )

a). Check the material of the tape for the packaged material and whether it should be re-taped (refer to the golden sample library ) ; b). Whether the indentations on the left and right sides of the tape are consistent;

c). Whether the cover material is consistent; d). Whether the tape winding direction is consistent; e). Whether the braiding material is consistent;

f). Whether the position of D pin of the positioning hole in the tape is correct; g). Whether all parts are in the same direction in the tape; h). Whether the date stamp on the tape is consistent with D/C ;

i). Whether the orientation of the tube material parts in the tube is consistent; j). Whether the upper and lower covers of the pallet material match;

k). After checking that there are no abnormalities in the packaging, take a photo and upload it to the system inspection sheet. To take photos of tape and reel packaging materials, you need to take one photo of the front and the back of the tape;

Check basic information:

Find the specification book link from the inspection order interface and click to jump to the specification book (if there is no link in the system, you can check the specification book on the official website /MOUSER/DGK and other websites)

Check whether the origin and batch information on the parts are consistent with the packaging label information; c). Check whether the packaging information is consistent with the specifications;

d). Whether it meets the special requirements of customers (batch, packaging, packaging, etc. ) ;

Check the physical appearance:

Front (refer to the gold sample library ) :

Check the appearance color consistency of the same batch;

Check the consistency of the typing positions of goods in the same batch;

Check whether the silk screen color and silk screen font are consistent with the gold sample;

Check whether the surface texture is consistent. The surface texture of normal plastic-sealed goods looks uneven and has a grainy feel. If the surface texture of the goods is polished, it will be smoothed and re-sprayed. There will be an obvious coating when viewed from the side;

Check whether the size and position of the positioning holes are consistent in the same batch; whether there is coating in the positioning holes ;

Whether the edge of the device presents a chamfered R- angle;

Will the font fade when wiped with acetone?

side :

Check whether there are coatings, residual glue, or scratches on the side of the object;

back :

a). Check whether the front and back textures are consistent;

Pin :

Check the inside and outside of the pins for scratches, indicating signs of previous use or mishandling ;

Check whether the pins are coplanar and whether they are deformed;

Check whether the pins show underlying metal exposed by cutting; d). Check whether the pins are oxidized;

f). For BGA packaging, check whether the solder balls are coplanar and whether the sizes of the solder balls are consistent; whether the substrate is clean

Oil stains and dirt left after washing;

Ontology :

Check whether the physical object is damaged, chipped, chipped, cracked, foreign matter, dirty or other defects;

Package size

Check whether the physical size meets the size requirements of the specification drawings;

X-ray inspection

Check the consistency of the internal structure of the physical object and whether there are any abnormalities such as disconnection;

Compare the internal wafer size and wiring position with the gold sample;

If you have any questions, you can apply for a De-cap test to further determine the authenticity;

De-cap opening test (if necessary )

After unsealing the chip, check its internal wafer, screen its internal manufacturing process, LOGO , Lot Number and other manufacturing information, and make accurate analysis and judgment based on the information of the original manufacturer of the chip to be inspected ;

If you have any doubts about the accuracy of the judgment result in the above testing process, you can apply to arrange an opening test to further determine the authenticity of the goods; or the business end / client may specify a request for testing;

Solderability testing and other functional testing (if required )

a ) . The business end / client specifies the requirements for testing;

Things to note during inspection:

Special attention should be paid when inspecting materials: Do not touch unpackaged IC chips directly with bare hands. You must operate on an anti-static workbench, wear an anti-static watch, anti-static gloves, and finger cots. Use detection tools when touching the chip. , including anti-static tweezers and vacuum pens, etc.;

ICs and chips must not be placed directly on the table, and must be operated on a console with anti-static cloth .

When visually inspecting or wiping chips and ICs , pay attention to protecting the pins and use a microscope and

Anti-static brushes and other tools;

If there are special requirements for receiving goods, the inspection must be carried out according to the requirements. If the requirements are not met, the relevant personnel and supervisor must be notified. At the same time, when the system is receiving goods, relevant exceptions must be filled in notes so that relevant personnel can take the next step. measure.

Warehouse handover

Materials that have been inspected must be stamped with a QC seal and placed in the inspected area in the order they are submitted for inspection , and will be handed over to the warehouse by those waiting to be put into the warehouse;

The work flow chart is as follows