Wire bonding with bare Cu and Pd coated Cu (PdCu) wire have been adopted quickly as a mainstream pac Kaging technology for high pin count and fine pitch devices. The differences between Au and Cu wire bonding are well understood as a result of extensive research . However, the differences between Cu a...
使用裸露的 Cu 和 Pd 涂层 Cu （PdCu） 线的引线键合已迅速成为高引脚数和细间距器件的主流 pac Kaging 技术。由于广泛的研究，Au 和 Cu 引线键合之间的差异已得到很好的理解。然而，铜和...

Copper (Cu) wire bonding has become a mainstream IC assembly solution due to its significant cost sa Vings over gold wire. However, concerns on corrosion susceptibility and package reliability have driven the industry to de Develop alternative materials. In recent years, palladium-coated copper (PdCu) w...
铜 （Cu） 引线键合已成为主流的 IC 组装解决方案，因为它的成本高于金线。然而，对腐蚀敏感性和封装可靠性的担忧促使该行业停止开发替代材料。近年来，镀钯铜 （PdCu） 在...

This paper describes the behavior of palladium in palladium-coated Cu (PdCu) wire bonding and its im Pact on bond reliability by utilizing transmission electron microscopy (TEM). A Pd layer approximately 80 nm thick, which is coated on the surface of Cu wire, dissolves into the Cu matrix during ball...
本文利用透射电子显微镜 （TEM） 描述了钯在镀钯铜 （PdCu） 引线键合中的行为及其对键合可靠性的影响。涂覆在铜丝表面的约 80 nm 厚的 Pd 层在球过程中溶解到 Cu 基体中......

In recent years, Pd-based intermetallic nanocrystals (INCs) have attracted widespread attention as e lectrocatalysts for fuel cells. The definite composition and predictable control over structural, geometric and electronic effects o F Pd-based INCs endow them outstanding catalytic activity and high s...
近年来，钯基金属间化合物纳米晶 （INC） 作为燃料电池的电子催化剂引起了广泛关注。基于 F Pd 的 INCs 的明确组成和对结构、几何和电子效应的可预测控制赋予了它们出色的催化活性和高稳定性。